march 2007 rev 7 1/9 9 stps745 power schottky rectifier main product characteristics features and benefits very small conduction losses negligible switching losses extremely fast switching insulated package: to-220fpac insulating voltage = 2000 v dc capacitance = 12 pf avalanche capability specified description single schottky rectifier suited for switch mode power supply and high frequency dc to dc converters. packaged either in to-220ac, to-220fpac or d 2 pak, this device is intended for use in low voltage, high frequency inverters, free wheeling and polarity protection applications. ??? i f(av) 7.5 a v rrm 45 v t j (max) 150 c v f (max) 0.57 v to-220fpac stps745fp to-220ac stps745d d 2 pak stps745g ak nc k a a k a k www.st.com
characteristics stps745 2/9 1 characteristics ? to evaluate the conduction losses use the following equation: p = 0.42 x i f(av) + 0.020 i f 2 (rms) table 1. absolute ratings (limiting values) symbo l parameter value unit v rrm repetitive peak reverse voltage 45 v i f(rms) rms forward voltage 20 a i f(av) average forward current = 0.5 to-220ac / d 2 pa k t c = 160 c 7.5 a to-220fpac t c = 145 c i fsm surge non repetitive forward current t p = 10 ms sinusoidal 150 a i rrm repetitive peak reverse current t p = 2 s square f = 1 khz 1 a i rsm non repetitive peak reverse current t p = 100 s square 2 a p arm repetitive peak avalanche power t p = 1 s t j = 25 c 2700 w t stg storage temperature range -65 to + 175 c t j maximum operating junction temperature (1) 1. thermal runaway condition for a diode on its own heatsink 175 c dv/dt critical rate of rise of reverse voltage 10000 v/s table 2. thermal resistances symbol parameter value unit r th (j-c) junction to case to-220ac / d 2 pa k 3 . 0 c/w to-220fpac 5.5 table 3. static electrical characteristics (per diode) symbol parameter test conditions min. typ. max. unit i r (1) 1. pulse test: tp = 380 s, < 2% reverse leakage current t j = 25 c v r = v rrm 100 a t j = 125 c 5 15 ma v f (1) forward voltage drop t j = 125 c i f = 7.5 a 0.5 0.57 v t j = 25 c i f = 15 a 0.84 t j = 125 c i f = 15 a 0.65 0.72 d ptot dtj - -------------- 1 rth j a ? () ------------------------- - <
stps745 characteristics 3/9 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) 012345678910 0 1 2 3 4 5 6 p (w) f(av) t =tp/t tp i (a) f(av) = 0.05 = 0.1 = 0.2 = 0.5 = 1 0 25 50 75 100 125 150 175 0 1 2 3 4 5 6 7 8 9 i (a) f(av) r =15c/w th(j-a) r =40c/w th(j-a) t =tp/t tp r=r th(j-a) th(j-c) t (c) amb to-220fpac to-220ac figure 3. normalized avalanche power derating versus pulse duration figure 4. normalized avalanche power derating versus junction temperature 0.001 0.01 0.1 0.01 1 0.1 10 100 1000 1 t (s) p p(t) p (1s) arm p arm 0 0.2 0.4 0.6 0.8 1 1.2 25 50 75 100 125 150 t (c) j p(t) p (25c) arm p arm figure 5. non repetitive surge peak forward current versus overload duration (maximum values) (to-220ac and d 2 pa k ) figure 6. non repetitive surge peak forwardcurrent versus overload duration (maximum values) (to-220fpac) 1e-3 1e-2 1e-1 1e+0 0 20 40 60 80 100 120 i (a) m i m t =0.5 t(s) t =50c c t =100c c t =150c c 1e-3 1e-2 1e-1 1e+0 0 10 20 30 40 50 60 70 80 i (a) m i m t =0.5 t(s) t =50c c t =100c c t =150c c
characteristics stps745 4/9 figure 7. relative variation of thermal transient impedance junction to case versus pulse duration (to-220ac and d 2 pa k ) figure 8. relative variation of thermal transient impedance junction to case versus pulse duration (to-220fpac) 1e-4 1e-3 1e-2 1e-1 1e+0 0.0 0.2 0.4 0.6 0.8 1.0 z/r th(j-c) th(j-c) t =tp/t tp t (s) p = 0.5 = 0.2 = 0.1 single pulse 1e-3 1e-2 1e-1 1e+0 1e+1 0.0 0.2 0.4 0.6 0.8 1.0 z/r th(j-c) th(j-c) t =tp/t tp t (s) p = 0.5 = 0.2 = 0.1 single pulse figure 9. reverse leakage current versus reverse voltage applied (typical values) figure 10. junction capacitance versus reverse voltage applied (typical values) 0 5 10 15 20 25 30 35 40 45 1e-1 1e+0 1e+1 1e+2 1e+3 1e+4 5e+4 i (a) r v (v) r t =125c j t =150c j t =100c j t =25c j t =50c j t =75c j 12 51020 50 100 200 500 1000 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j figure 11. forward voltage drop versus forward current (maximum values) figure 12. thermal resistance junction to ambient versus copper surface under tab (epoxy printed circuit board, copper thickness: 35 m) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.1 1.0 10.0 100.0 i (a) fm t =125c (typical values) j t =25c j t =125c j v (v) fm 0 2 4 6 8 101214161820 0 10 20 30 40 50 60 70 80 r (c/w) th(j-a) s(cu)(cm2)
stps745 package information 5/9 2 package information epoxy meets ul94, v0 cooling method: by conduction (c) recommended torque value: 0.55 nm maximum torque value: 0.70 nm figure 13. footprint (dimensions in millimeters) table 4. d 2 pak dimensions ref dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 a1 2.49 2.69 0.098 0.106 a2 0.03 0.23 0.001 0.009 b 0.70 0.93 0.027 0.037 b2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.23 1.36 0.048 0.054 d 8.95 9.35 0.352 0.368 e 10.00 10.40 0.393 0.409 g 4.88 5.28 0.192 0.208 l 15.00 15.85 0.590 0.624 l2 1.27 1.40 0.050 0.055 l3 1.40 1.75 0.055 0.069 m 2.40 3.20 0.094 0.126 r 0.40 typ. 0.016 typ. v2 0 8 0 8 g l l3 l2 b b2 e * flat zone no less than 2m m a c2 d r a2 m v2 c a1 * 16.90 10.30 8.90 3.70 5.08 1.30
package information stps745 6/9 table 5. to-220fpac dimensions ref dimensions millimeters inches min. max. min. max. a 4.4 4.6 0.173 0.181 b 2.5 2.7 0.098 0.106 d 2.5 2.75 0.098 0.108 e 0.45 0.70 0.018 0.027 f 0.75 1 0.030 0.039 f1 1.15 1.70 0.045 0.067 g 4.95 5.20 0.195 0.205 g1 2.4 2.7 0.094 0.106 h 10 10.4 0.393 0.409 l2 16 typ. 0.63 typ. l3 28.6 30.6 0.126 1.205 l4 9.8 10.6 0.386 0.417 l5 2.9 3.6 0.114 0.142 l6 15.9 16.4 0.626 0.646 l7 9.00 9.30 0.354 0.366 dia. 3.00 3.20 0.118 0.126 h a b dia l7 l6 l5 f1 f d e l4 g1 g l2 l3
stps745 package information 7/9 in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com. table 6. to-220ac dimensions ref dimensions millimeters inches min. max. min. max. a 4.40 4.60 0.173 0.181 c 1.23 1.32 0.048 0.051 d 2.40 2.72 0.094 0.107 e 0.49 0.70 0.019 0.027 f 0.61 0.88 0.024 0.034 f1 1.14 1.70 0.044 0.066 f2 1.14 1.70 0.044 0.066 g 4.95 5.15 0.194 0.202 g1 2.40 2.70 0.094 0.106 h2 10 10.40 0.393 0.409 l2 16.4 typ. 0.645 ty p. l4 13 14 0.511 0.551 l5 2.65 2.95 0.104 0.116 l6 15.25 15.75 0.600 0.620 l7 6.20 6.60 0.244 0.259 l9 3.50 3.93 0.137 0.154 m 2.6 typ. 0.102 typ. diam. 3.75 3.85 0.147 0.151 a c d l7 ? i l5 l6 l9 l4 f h2 g l2 f1 e m
ordering information stps745 8/9 3 ordering information 4 revision history ordering type marking package weight base qty delivery mode stps745d stps745d to-220ac 1.86 g 50 tube stps745g stps745g d 2 pak 1.48 g 50 tube stps745g-tr stps745g d 2 pak 1.48 g 1000 tape & reel stps745fp stps745fp to-220fpac 1.9 g 50 tube date revision description of changes jul-2003 6g last release. 22-mar-2007 7 removed isowatt package.
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